Under the patronage of the Custodian of the Two Holy Mosques King Abdullah Bin Abdulaziz, activities of the Saudi International Electronics, Communications and Photonics Conference commenced today. The conference is organized by King Abdul Aziz City for Science and Technology (KACST) at its headquarters in association with the Institute of Electrical and Electronics Engineers (IEEE) in a remarkable presence of distinguished international experts, researchers and speakers in this field.
The first tutorial for Max Planck Institute of Quantum Optics (MPQ) in collaboration with Kind Saud University (KSU) started under the title of “Limits of Electronics and Photonics”. It was chaired by Dr. Abdullah Azzeer, professor of Physics & Astronomy and head of the research team of KSU-MPQ collaboration. The tutorial comprehended three work papers; the first was on Smart XUV radiation generation with boosting cavities. The second paper handled Electronics, light emission, electric current load and binding atoms together to form new molecules, while the third paper dealt with ultra speed and control of carbon dioxide isolator used in femtosecond and attosecond.
During the second tutorial titles “Advanced RF, Microwave and High Speed Digital Circuits Design”, Agilent Technologies Company, reviewed the latest development in simulation technologies and their integration into a complete front-to-back design flow for RF and Microwave circuit design as well as advances in integrated circuit/3D electromagnetic simulation. 
Mentor Graphics Corporation, in the third tutorial titled “Functional Applications through HW simulation and Accelerating Models”. The tutorial also tackled some pre-recorded designs from the real life that are directed to design-engineers and researchers interested in Computer Aided Design (CAD).
KACST and ESIEE-Université Paris-Est, presented the fourth tutorial titled “Micro Electro Mechanical Systems (MEMS): from the basics to the latest trends and opportunities” that elaborated on the main scaling laws and physical principles involved in the operation of the components obtained from this technology.
Si-Ware Systems, in the fifth tutorial titled “ASIC interface for MEMS” Si-Ware discussed the most important challenges in complementing a Sensing element(s) with a mixed-signal ASIC targeting a specific application. An integrated Sensing product is a combination of sensor device(s), ASIC, packaging and testing. This is a four dimensional space that requires very careful planning, execution and technical tradeoffs. Typically the complexity and intelligence of the ASIC may decrease significantly the testing cost and help tolerate process spread of two uncorrelated technologies of the ASIC and sensor. The flow of technical data between different engineering teams allows for more deterministic schedules yet this requires advanced design methodologies and modeling techniques of sensor devices compatible with ASIC design flows and simulation tools.
The sixth tutorial was presented by the National Instruments under the title of “PXI & LabVIEW in Data Acquisition and Communication Systems Hardware Prototyping” during which a synopsis covered cover the basics of Data Acquisition using NI DAQ hardware. The second part will cover the basics of simulation and prototyping of a complete communication system using LabVIEW and NI PXI RF.
The Council for Scientific and Industrial Research (CSIR) presented the seventh and last tutorial of the day under the title of “Measurement, Modeling, and simulation of IR Systems” that discussed some applied studies of measurement, modeling and simulation with applications on aircraft self-protection, missile development, signature prediction and image processing development.